Elon Musk is set to pitch SpaceX’s Terafab chip project to employees of ASML, the Dutch semiconductor equipment giant, during a virtual fireside chat with CEO Christophe Fouquet at the company’s annual technology conference on June 11-12, 2026.
Terafab is a vertically integrated semiconductor initiative announced on March 21, 2026, as a joint effort by Tesla, SpaceX, and xAI, with Intel contributing its 14A process technology. The initial funding target is $20 billion to $25 billion, with the facility planned for Grimes County, Texas, carrying a $55 billion price tag and total projected costs reaching $119 billion. The goal is annual production of more than 1 terawatt of AI computing power.
ASML’s CEO Fouquet has already discussed the project with Musk and called it a “serious endeavor,” a notable validation given ASML’s selective approach to its extreme ultraviolet lithography machines, which are essential for producing the world’s most advanced chips.
The timing aligns with SpaceX’s preparations for a public debut. Terafab addresses SpaceX’s need for custom silicon for orbital data centers and provides IPO investors a growth story beyond rockets and Starlink.