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Kandou AI Raises $225 Million for New Copper-Based Chip Interconnects

Swiss startup Kandou AI secures $225M led by SoftBank. Firm develops copper interconnects for efficient AI chip clusters, challenging fiber optic standards.

2026-03-24T03:08:34.246Z

Kandou AI Raises $225 Million for New Copper-Based Chip Interconnects

Swiss semiconductor firm Kandou AI announced today it has raised $225 million. The investment values the startup at $400 million. Major backers include SoftBank Group, Synopsys, and Cadence Design Systems.

Kandou specializes in copper-based interconnects designed for artificial intelligence clusters. Their flagship product, Glasswing, uses CNRZ-5 Chord technology to transmit data using half the power of standard fiber optics.

CEO Srujan Linga shifted the company's focus to AI infrastructure last year. This funding surge mirrors recent rounds for competitors Ayar Labs and Xscape Photonics.

Topics Kandou AI SoftBank Group Synopsys Glasswing Srujan Linga CNRZ-5 Chord