Taipei-based chip designer MediaTek has appointed Douglas Yu, a former TSMC executive, as a part-time adviser to accelerate its push into advanced chip packaging and the AI market.
Yu joined TSMC in 1994 and retired in 2025, playing a key role in developing CoWoS (Chip on Wafer on Substrate) packaging technology, which is essential for AI chips from Nvidia and others.
MediaTek said in a statement Saturday it aims to leverage Yu's expertise for future packaging technology roadmaps and R&D investment strategy.
The move comes as TSMC's CoWoS capacity faces soaring demand from customers like Nvidia and cloud providers, and as MediaTek projects billions in revenue from AI accelerator chips by 2027.