Micron Technology is committing approximately ¥1.5 trillion, or $9.6 billion, to expand its chip factory in Hiroshima, Japan. The target is high-bandwidth memory, the specialized architecture critical for artificial intelligence computing.
Construction begins in May 2026, with initial shipments projected for 2028. The Japanese government pledged subsidies up to ¥536 billion to support the project.
Japan has been working methodically to reclaim relevance in memory chip production after losing ground to South Korean competitors. The Hiroshima expansion leverages an existing workforce, reducing execution risk compared to a new site.
Investors should note that Samsung and SK Hynix currently lead HBM production at scale. Micron’s 2028 timeline means the competitive landscape could shift significantly before the factory reaches full volume. The Japanese subsidy also introduces a policy dependency that could impact project terms if industrial policy shifts.