Samsung and AMD Expand AI Memory Pact, Explore Foundry Collaboration

Samsung Electronics and Advanced Micro Devices (AMD) signed a memorandum of understanding to deepen their AI infrastructure partnership.

The agreement centers on Samsung supplying its next-generation high-bandwidth memory HBM4 for AMD’s upcoming Instinct MI455X AI accelerators-and optimized DDR5 memory for AMD’s sixth-generation EPYC processors.

Both companies will also explore a foundry partnership, potentially enabling Samsung to manufacture next-generation AMD chips.

Samsung is already AMD’s primary HBM supplier, providing HBM3E for the MI350X and MI355X accelerators.

The deal arrives amid heightened competition for advanced memory supply, driven by surging AI demand and constrained HBM capacity.

AMD recently secured $60 billion in AI chip orders from Meta over five years-and previously signed a major agreement with OpenAI.