Chey Tae-won
3 stories
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techSK Hynix Plans to Triple Wafer Capacity by 2034 for AI Dominance
SK Hynix targets tripling wafer capacity by 2034 via four new fabs and advanced packaging investments to secure global HBM leadership amid surging AI infrastructure demand.
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techSK Group Chairman: Chip Wafer Shortage to Last Until 2030
SK Group's Chey Tae-won forecasts prolonged semiconductor shortage amid AI demand, discusses DRAM pricing strategy and potential U.S. ADR listing.
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techSK Group Chairman Predicts Chip Shortage Until 2030 Amid AI Surge
SK Group Chairman Chey Tae-won forecasts persistent wafer shortages through 2030 driven by AI demand while SK Hynix considers a US ADR listing.