University of Illinois Urbana-Champaign
2 stories
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techAI-Designed Copper Cold Plates Slash Data Center Energy Costs
Engineers at UIUC and Fabric8Labs developed AI-optimized copper cold plates using electrochemical manufacturing, reducing data center cooling energy consumption by up to 32 percent.
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tech3D Chip Breakthrough Could Extend Moore's Law, Researchers Say
Researchers at UIUC have developed a method to stack silicon transistors vertically, overcoming heat barriers that previously prevented 3D chip fabrication.