Broadcom anticipates selling at least 1 million chips utilizing its 3D stacked design technology by 2027. This advanced approach layers two chips to enhance data flow speed, a development refined over five years. Fujitsu, an early customer, is already producing engineering samples with full production expected later this year.
This technology allows customers to build more powerful, energy-efficient chips to meet escalating AI computing demands. Broadcom, known for its custom chip design collaboration with tech giants like Google and OpenAI, plays a key role in translating early designs into fabrication-ready layouts. This segment has fueled significant growth, with Broadcom projecting its AI chip revenue to double year-over-year to $8.2 billion this fiscal quarter.
The company's innovation positions it as a strong competitor against industry leaders like Nvidia and AMD. Fujitsu is implementing this technology for a data center chip, with Taiwan Semiconductor Manufacturing Co. (TSMC) handling fabrication using its advanced 2-nanometer and 5-nanometer processes. Broadcom has additional stacked chip products planned for release and sampling in the coming years, with research into designs incorporating up to eight stacked chip pairs.