BE Semiconductor Industries (BESI) announced robust first-quarter orders, surpassing last year's figures. The company experienced growth across all markets, with a notable surge in demand for hybrid bonding technology.
This chip technology, which allows direct bonding of two chips, is seeing increased investor interest due to its first-mover advantage in the AI sector. CEO Richard Blickman stated that favorable Q1 order trends highlight Besi's strong market position for next-generation AI applications.
Investments in AI are currently counterbalancing weaker demand in automotive, PC, and memory chip segments. Besi anticipates second-quarter revenue growth between 30% and 40%.