Huawei has introduced enterprise SSDs with capacities of 61.44 TB and 122.88 TB, unveiled at the Huawei ID Forum 2026 in Paris. The key innovation is a proprietary technique called Die-on-Board (DoB) packaging, which mounts NAND flash dies directly onto the printed circuit board, achieving roughly 33% higher density from the same memory technology.
US sanctions have limited Huawei to domestic NAND suppliers like YMTC, whose chips top out at approximately 232 layers. By eliminating traditional chip packaging overhead, Huawei's engineers can fit more dies per drive, compensating for the layer-count disadvantage.
Huawei is already integrating the 122.88 TB drives into its OceanStor Pacific 9926 all-flash array. A single system with 36 drives delivers 4.42 PB of raw storage, expanding to approximately 11 PB with data compression. The drives are designed for AI inference, data centers, and scale-out storage.
A 245 TB variant is reportedly in production. If YMTC pushes past 232 layers, future capacities could scale significantly.